Three-dimensional temperature mapping of stacked dies

Darshan Chalise, Pei-Yun Lin, and David G. Cahill
Semiconductor Research Corporation

Mapping temperature in 3D is a hard problem. Infrared cameras and thermoreflectance microscopes can map temperature at a surface but stacked dies with metallic interconnects and vias are opaque to infrared and visible wavelengths. We are exploring the use of x-ray diffraction and magnetic resonance at MHz (nuclear moments) and GHz (electronic moments) frequencies to map temperature within the volume of a device or within the volume of a heat transfer fluid.